A successful implementation of dual damascene architecture to copper TSV for 3D high density applications.
Rebha El FarhaneMyriam AssousPatrick LeducAurélie ThuaireDavid BouchuHélène FeldisNicolas SillonPublished in: 3DIC (2010)
Keyphrases
- high density
- magnetic recording
- thin film
- integrated circuit
- low density
- layered architecture
- close proximity
- hardware architecture
- high power
- hardware implementation
- design considerations
- magnetic tape
- design methodology
- architectural design
- efficient implementation
- vlsi implementation
- software implementation
- platform independent
- database
- management system
- low cost
- software architecture
- data center
- fpga technology
- java platform
- instruction set
- high bandwidth
- parallel architecture
- hardware design
- multi layer
- databases