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Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.

T. FrankStéphane MoreauCédrick ChappazPatrick LeducLucile ArnaudAurélie ThuaireE. CheryF. LorutLorena AnghelGilles Poupon
Published in: Microelectron. Reliab. (2013)
Keyphrases
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