First integration of Cu TSV using die-to-wafer direct bonding and planarization.
Patrick LeducMyriam AssousLéa Di CioccioMarc ZussyThomas SignamarcheixAntonio RomanMaxime RousseauSophie VerrunLaurent BallyDavid BouchuLionel CadixAlexis FarcyNicolas SillonPublished in: 3DIC (2009)