Lionel Cadix

Publication Activity (10 Years)

Years Active: 2009-2009
Publications (10 Years): 0

Publications

Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon
First integration of Cu TSV using die-to-wafer direct bonding and planarization. 3DIC (2009)
Elie Eid, Thierry Lacrevaz, Sébastien de Rivaz, Cédric Bermond, Bernard Fléchet, Francis Calmon, Christian Gontrand, Alexis Farcy, Lionel Cadix, Pascal Ancey
Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking. 3DIC (2009)
Julie Roullard, Stéphane Capraro, Thierry Lacrevaz, Lionel Cadix, Elie Eid, Alexis Farcy, Bernard Fléchet
Influence of 3D integration on 2D interconnections and 2D self inductors HF properties. 3DIC (2009)
Lionel Cadix, Alexis Farcy, Cédric Bermond, Christine Fuchs, Patrick Leduc, Maxime Rousseau, Myriam Assous, Alexandre Valentian, Julie Roullard, Elie Eid, Nicolas Sillon, Bernard Fléchet, Pascal Ancey
Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits. 3DIC (2009)