Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits.
Lionel CadixAlexis FarcyCédric BermondChristine FuchsPatrick LeducMaxime RousseauMyriam AssousAlexandre ValentianJulie RoullardElie EidNicolas SillonBernard FléchetPascal AnceyPublished in: 3DIC (2009)
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