Cédric Bermond

Publication Activity (10 Years)

Years Active: 2009-2021
Publications (10 Years): 2

Top Topics

Measurement Error

Integrated Circuit

Software Package

Top Venues

Microelectron. J.

IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.

Publications

Cédric Bermond, Philippe Artillan, Michel Gay
A Microwave Frequency Range Experiment for the Measurement of Snow Density and Liquid Water Content. IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens. 14 (2021)
Gregory Houzet, Thierry Lacrevaz, Cédric Bermond, Philippe Artillan, David Auchère, Laurent Schwarz, Bernard Fléchet
In-situ characterization up to 100 GHz of insulators used in new 3D "System in Package on board" (SiPoB) technologies. Microelectron. J. 108 (2021)
Khadim Dieng, Philippe Artillan, Cédric Bermond, Olivier Guiller, Thierry Lacrevaz, Sylvain Joblot, Gregory Houzet, Alexis Farcy, Yann Lamy, Bernard Fléchet
Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer. 3DIC (2014)
Melanie Brocard, Cédric Bermond, Thierry Lacrevaz, Alexis Farcy, Patrick Le Maitre, P. Scheer, Patrick Leduc, Séverine Cheramy, Bernard Fléchet
RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits. 3DIC (2013)
Elie Eid, Thierry Lacrevaz, Sébastien de Rivaz, Cédric Bermond, Bernard Fléchet, Francis Calmon, Christian Gontrand, Alexis Farcy, Lionel Cadix, Pascal Ancey
Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking. 3DIC (2009)
Lionel Cadix, Alexis Farcy, Cédric Bermond, Christine Fuchs, Patrick Leduc, Maxime Rousseau, Myriam Assous, Alexandre Valentian, Julie Roullard, Elie Eid, Nicolas Sillon, Bernard Fléchet, Pascal Ancey
Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits. 3DIC (2009)