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Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits.
Stéphane Moreau
David Bouchu
J. Jourdon
Bassel Ayoub
S. Lhostis
Hélène Frémont
P. Lamontagne
Published in:
IRPS (2023)
Keyphrases
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recent advances
integrated circuit
mechanical properties
electron microscopy
electrical properties
silicon dioxide
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