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Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits.

Stéphane MoreauDavid BouchuJ. JourdonBassel AyoubS. LhostisHélène FrémontP. Lamontagne
Published in: IRPS (2023)
Keyphrases