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Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence.

Simon GousseauStéphane MoreauDavid BouchuAlexis FarcyPierre MontmitonnetKarim InalFrançois BayMarc ZelsmannEmmanuel PicardMathieu Salaün
Published in: Microelectron. Reliab. (2015)
Keyphrases
  • input output
  • failure prediction
  • data sets
  • artificial intelligence
  • material properties
  • axiomatic characterization