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Sequential combined thermal cycling and vibration test and simulation of printed circuit board.

Faical ArabiAlexandrine Guédon-GraciaJean-Yves DelétageHélène Frémont
Published in: Microelectron. Reliab. (2018)
Keyphrases
  • printed circuit boards
  • stress response
  • dynamic characteristics
  • computer vision
  • image processing
  • case study
  • object oriented
  • simulation model
  • heat transfer