Faical Arabi

Publication Activity (10 Years)

Years Active: 2015-2018
Publications (10 Years): 3

Top Topics

Printed Circuit Boards

Electronic Devices

High Temperature

Stress Response

Top Venues

Microelectron. Reliab.

Publications

Faical Arabi, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Frémont
Sequential combined thermal cycling and vibration test and simulation of printed circuit board. Microelectron. Reliab. (2018)
Wissam Sabbah, Faical Arabi, Oriol Avino-Salvado, Cyril Buttay, L. Théolier, Hervé Morel
Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling. Microelectron. Reliab. (2017)
Faical Arabi, L. Théolier, D. Martineau, Jean-Yves Delétage, M. Medina, Eric Woirgard
Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices. Microelectron. Reliab. 64 (2016)
Eric Woirgard, Faical Arabi, Wissam Sabbah, D. Martineau, L. Théolier, Stephane Azzopardi
Identification and analysis of power substrates degradations subjected to severe aging tests. Microelectron. Reliab. 55 (9-10) (2015)