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Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices.
Faical Arabi
L. Théolier
D. Martineau
Jean-Yves Delétage
M. Medina
Eric Woirgard
Published in:
Microelectron. Reliab. (2016)
Keyphrases
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printed circuit boards
mechanical properties
mobile devices
power consumption
semiconductor devices
image quality
high density
smart phones
design automation
handheld devices
embedded devices
failure rate
electronic devices
database
power distribution
mechanical design
electrical power