Eric Woirgard

Publication Activity (10 Years)

Years Active: 2001-2018
Publications (10 Years): 4

Top Topics

Light Emitting Diodes

Schottky Barrier

High Temperature

Power Electronics

Top Venues

Microelectron. Reliab.

Publications

Omar Chihani, L. Théolier, Alain Bensoussan, Jean-Yves Delétage, André Durier, Eric Woirgard
Effect of HTRB lifetest on AlGaN/GaN HEMTs under different voltages and temperatures stresses. Microelectron. Reliab. (2018)
Omar Chihani, Loic Théolier, Jean-Yves Delétage, Eric Woirgard, Alain Bensoussan, André Durier
Temperature and voltage effects on HTRB and HTGB stresses for AlGaN/GaN HEMTs. IRPS (2018)
Maxime Barrière, Alexandrine Guédon-Gracia, Eric Woirgard, Serge Bontemps, François Le Henaff
Innovative conception of SiC MOSFET-Schottky 3D power inverter module with double side cooling and stacking using silver sintering. Microelectron. Reliab. (2017)
Faical Arabi, L. Théolier, D. Martineau, Jean-Yves Delétage, M. Medina, Eric Woirgard
Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices. Microelectron. Reliab. 64 (2016)
Houssam Arbess, F. Baccar, L. Théolier, Stephane Azzopardi, Eric Woirgard
using BenzoCycloButene as dielectric material. Microelectron. Reliab. 55 (9-10) (2015)
Toni Youssef, W. Rmili, Eric Woirgard, Stephane Azzopardi, N. Vivet, D. M. Meekhof, Régis Meuret, G. Le Quilliec, C. Richard
Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity. Microelectron. Reliab. 55 (9-10) (2015)
Eric Woirgard, Faical Arabi, Wissam Sabbah, D. Martineau, L. Théolier, Stephane Azzopardi
Identification and analysis of power substrates degradations subjected to severe aging tests. Microelectron. Reliab. 55 (9-10) (2015)
F. Baccar, Houssam Arbess, L. Théolier, Stephane Azzopardi, Eric Woirgard
) Diode. Microelectron. Reliab. 55 (9-10) (2015)
Wissam Sabbah, Stephane Azzopardi, Cyril Buttay, Régis Meuret, Eric Woirgard
Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy. Microelectron. Reliab. 53 (9-11) (2013)
F. Baccar, Stephane Azzopardi, L. Théolier, K. El Boubkari, Jean-Yves Delétage, Eric Woirgard
Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach. Microelectron. Reliab. 53 (9-11) (2013)
Akram Eddahech, Olivier Briat, Eric Woirgard, Jean-Michel Vinassa
Remaining useful life prediction of lithium batteries in calendar ageing for automotive applications. Microelectron. Reliab. 52 (9-10) (2012)
François Le Henaff, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard, Serge Bontemps, Julien Joguet
A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization. Microelectron. Reliab. 52 (9-10) (2012)
Ramzi Chaari, Olivier Briat, Jean-Yves Delétage, Eric Woirgard, Jean-Michel Vinassa
How supercapacitors reach end of life criteria during calendar life and power cycling tests. Microelectron. Reliab. 51 (9-11) (2011)
Akram Eddahech, Olivier Briat, Hervé Henry, Jean-Yves Delétage, Eric Woirgard, Jean-Michel Vinassa
Ageing monitoring of lithium-ion cell during power cycling tests. Microelectron. Reliab. 51 (9-11) (2011)
Olivier Briat, Jean-Michel Vinassa, Nicolas Bertrand, H. El Brouji, Jean-Yves Delétage, Eric Woirgard
Contribution of calendar ageing modes in the performances degradation of supercapacitors during power cycling. Microelectron. Reliab. 50 (9-11) (2010)
Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard
Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature. Microelectron. Reliab. 50 (9-11) (2010)
Yassine Belmehdi, Stephane Azzopardi, A. Benmansour, Jean-Yves Delétage, Eric Woirgard
Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation. Microelectron. Reliab. 49 (9-11) (2009)
E.-Hassane El Brouji, Olivier Briat, Jean-Michel Vinassa, Nicolas Bertrand, Eric Woirgard
Impact of Calendar Life and Cycling Ageing on Supercapacitor Performance. IEEE Trans. Veh. Technol. 58 (8) (2009)
Alexandre Micol, A. Zeanh, T. Lhommeau, Stephane Azzopardi, Eric Woirgard, Olivier Dalverny, Moussa Karama
An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications. Microelectron. Reliab. 49 (9-11) (2009)
H. El Brouji, Olivier Briat, Jean-Michel Vinassa, Hervé Henry, Eric Woirgard
Analysis of the dynamic behavior changes of supercapacitors during calendar life test under several voltages and temperatures conditions. Microelectron. Reliab. 49 (9-11) (2009)
H. El Brouji, Olivier Briat, Jean-Michel Vinassa, Nicolas Bertrand, Eric Woirgard
Comparison between changes of ultracapacitors model parameters during calendar life and power cycling ageing tests. Microelectron. Reliab. 48 (8-9) (2008)
A. Benmansour, Stephane Azzopardi, J. C. Martin, Eric Woirgard
A step by step methodology to analyze the IGBT failure mechanisms under short circuit and turn-off inductive conditions using 2D physically based device simulation. Microelectron. Reliab. 47 (9-11) (2007)
Walid Lajnef, Jean-Michel Vinassa, Olivier Briat, H. El Brouji, Eric Woirgard
Monitoring fading rate of ultracapacitors using online characterization during power cycling. Microelectron. Reliab. 47 (9-11) (2007)
A. Benmansour, Stephane Azzopardi, J. C. Martin, Eric Woirgard
Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions. Microelectron. Reliab. 47 (9-11) (2007)
A. Benmansour, Stephane Azzopardi, J. C. Martin, Eric Woirgard
Failure mechanism of trench IGBT under short-circuit after turn-off. Microelectron. Reliab. 46 (9-11) (2006)
Olivier Briat, Walid Lajnef, Jean-Michel Vinassa, Eric Woirgard
Power cycling tests for accelerated ageing of ultracapacitors. Microelectron. Reliab. 46 (9-11) (2006)
Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini
Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability. Microelectron. Reliab. 45 (9-11) (2005)
Walid Lajnef, Jean-Michel Vinassa, Olivier Briat, Eric Woirgard
Specification and use of pulsed current profiles for ultracapacitors power cycling. Microelectron. Reliab. 45 (9-11) (2005)
Stephane Azzopardi, A. Benmansour, M. Ishiko, Eric Woirgard
Assessment of the Trench IGBT reliability: low temperature experimental characterization. Microelectron. Reliab. 45 (9-11) (2005)
Alexandrine Guédon-Gracia, Pascal Roux, Eric Woirgard, Christian Zardini
Influence of the thermo-mechanical residual state on the power assembly modellization. Microelectron. Reliab. 44 (9-11) (2004)
Alexandrine Guédon, Eric Woirgard, Christian Zardini, Guillaume Simon
Methodology to evaluate the correspondence between real conditions and accelerated tests of a thyristor system used in a power plant. Microelectron. Reliab. 43 (9-11) (2003)
Stephane Azzopardi, Eric Woirgard, Jean-Michel Vinassa, Olivier Briat, Christian Zardini
IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power? Microelectron. Reliab. 43 (9-11) (2003)
P. Guilbault, Eric Woirgard, Christian Zardini, D. Lambert
Reliability study of the assembly of a large EGA on a build up board using thermo-mechanical simulations. Microelectron. Reliab. 42 (9-11) (2002)
Alexandrine Guédon, Eric Woirgard, Christian Zardini
Evaluation of lead-free soldering for automotive applications. Microelectron. Reliab. 42 (9-11) (2002)
Stephane Azzopardi, Atsuo Kawamura, Hideo Iwamoto, Olivier Briat, Jean-Michel Vinassa, Eric Woirgard, Christian Zardini
Local lifetime control IGBT structures: turn-off performances comparison for hard- and soft-switching between 1200V trench and new planar PT-IGBTs. Microelectron. Reliab. 41 (9-10) (2001)