Stephane Azzopardi

Publication Activity (10 Years)

Years Active: 2001-2019
Publications (10 Years): 7

Top Topics

Light Emitting Diodes

Schottky Barrier

Temporal Evolution

Power Electronics

Top Venues

Microelectron. Reliab.

Publications

Bertrand Revol, Stephane Azzopardi, Toni Youssef, Jean Sylvio Ngoua Teu, Cyrille Gautier, Rabih Khazaka, Sara Roggia
Overview and new trends in technology bricks for reliability enhancement in future wide band gap power converters for More Electrical Aircraft (MEA) and More Electrical Propulsion (MEP) systems. IECON (2019)
Thilini Wickramasinghe, Stephane Azzopardi, Bruno Allard, Cyril Buttay, Charles Joubert, Christian Martin, Jean-François Mogniotte, Hervé Morel, Pascal Bevilacqua, Thanh-Long Le
A Study on Shunt Resistor-based Current Measurements for Fast Switching GaN Devices. IECON (2019)
Tien Anh Nguyen, Stéphane Lefebvre, Stephane Azzopardi
Effect of short circuit aging on safe operating area of SiC MOSFET. Microelectron. Reliab. (2018)
Houssam Arbess, F. Baccar, L. Théolier, Stephane Azzopardi, Eric Woirgard
using BenzoCycloButene as dielectric material. Microelectron. Reliab. 55 (9-10) (2015)
Toni Youssef, W. Rmili, Eric Woirgard, Stephane Azzopardi, N. Vivet, D. M. Meekhof, Régis Meuret, G. Le Quilliec, C. Richard
Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity. Microelectron. Reliab. 55 (9-10) (2015)
Eric Woirgard, Faical Arabi, Wissam Sabbah, D. Martineau, L. Théolier, Stephane Azzopardi
Identification and analysis of power substrates degradations subjected to severe aging tests. Microelectron. Reliab. 55 (9-10) (2015)
F. Baccar, Houssam Arbess, L. Théolier, Stephane Azzopardi, Eric Woirgard
) Diode. Microelectron. Reliab. 55 (9-10) (2015)
Wissam Sabbah, Stephane Azzopardi, Cyril Buttay, Régis Meuret, Eric Woirgard
Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy. Microelectron. Reliab. 53 (9-11) (2013)
F. Baccar, Stephane Azzopardi, L. Théolier, K. El Boubkari, Jean-Yves Delétage, Eric Woirgard
Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach. Microelectron. Reliab. 53 (9-11) (2013)
François Le Henaff, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard, Serge Bontemps, Julien Joguet
A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization. Microelectron. Reliab. 52 (9-10) (2012)
Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard
Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature. Microelectron. Reliab. 50 (9-11) (2010)
Yassine Belmehdi, Stephane Azzopardi, A. Benmansour, Jean-Yves Delétage, Eric Woirgard
Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation. Microelectron. Reliab. 49 (9-11) (2009)
Alexandre Micol, A. Zeanh, T. Lhommeau, Stephane Azzopardi, Eric Woirgard, Olivier Dalverny, Moussa Karama
An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications. Microelectron. Reliab. 49 (9-11) (2009)
A. Benmansour, Stephane Azzopardi, J. C. Martin, Eric Woirgard
A step by step methodology to analyze the IGBT failure mechanisms under short circuit and turn-off inductive conditions using 2D physically based device simulation. Microelectron. Reliab. 47 (9-11) (2007)
A. Benmansour, Stephane Azzopardi, J. C. Martin, Eric Woirgard
Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions. Microelectron. Reliab. 47 (9-11) (2007)
A. Benmansour, Stephane Azzopardi, J. C. Martin, Eric Woirgard
Failure mechanism of trench IGBT under short-circuit after turn-off. Microelectron. Reliab. 46 (9-11) (2006)
Stephane Azzopardi, A. Benmansour, M. Ishiko, Eric Woirgard
Assessment of the Trench IGBT reliability: low temperature experimental characterization. Microelectron. Reliab. 45 (9-11) (2005)
Walid Lajnef, Jean-Michel Vinassa, Stephane Azzopardi, Olivier Briat, Alexandrine Guédon-Gracia, Christian Zardini
First step in the reliability assessment of ultracapacitors used as power source in hybrid electric vehicles. Microelectron. Reliab. 44 (9-11) (2004)
Stephane Azzopardi, Eric Woirgard, Jean-Michel Vinassa, Olivier Briat, Christian Zardini
IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power? Microelectron. Reliab. 43 (9-11) (2003)
Stephane Azzopardi, Atsuo Kawamura, Hideo Iwamoto, Olivier Briat, Jean-Michel Vinassa, Eric Woirgard, Christian Zardini
Local lifetime control IGBT structures: turn-off performances comparison for hard- and soft-switching between 1200V trench and new planar PT-IGBTs. Microelectron. Reliab. 41 (9-10) (2001)