Kirsten Weide-Zaage

Publication Activity (10 Years)

Years Active: 2001-2023
Publications (10 Years): 4

Top Topics

Design Methodology

Scale Invariant

Hardware Architectures

Electrical Properties

Top Venues

Microelectron. Reliab.

Publications

Eike Trumann, Gia Bao Thieu, Johannes Schmechel, Kirsten Weide-Zaage, Katharina Schmidt, Dorian Hagenah, Guillermo Payá Vayá
Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology. ARC (2023)
Kirsten Weide-Zaage
Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation). Microelectron. Reliab. (2017)
Verena Hein, Marco Erstling, Raj Sekar Sethu, Kirsten Weide-Zaage, Tianlin Bai
Reliability evaluation of tungsten donut-via as an element of the highly robust metallization. Microelectron. Reliab. 64 (2016)
Alexandrine Guédon-Gracia, Hélène Frémont, Bernard Plano, Jean-Yves Delétage, Kirsten Weide-Zaage
Effects of salt spray test on lead-free solder alloy. Microelectron. Reliab. 64 (2016)
Mohd Faizul Mohd Sabri, Nor Ilyana Muhd Nordin, Suhana Mohd Said, Nur Aishah Aminah Mohd Amin, Hamzah Arof, Iswadi Jauhari, Roziana Ramli, Kirsten Weide-Zaage
Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys. Microelectron. Reliab. 55 (9-10) (2015)
Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano
bumps. Microelectron. Reliab. 55 (1) (2015)
Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont
Dynamical IMC-growth calculation. Microelectron. Reliab. 55 (9-10) (2015)
Kirsten Weide-Zaage, J. Schlobohm, R. T. H. Rongen, F. C. Voogt, R. Roucou
Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core. Microelectron. Reliab. 54 (6-7) (2014)
Verena Hein, Jörg Kludt, Kirsten Weide-Zaage
Evaluation new corner stress relief structure layout for high robust metallization. Microelectron. Reliab. 54 (9-10) (2014)
R. T. H. Rongen, R. Roucou, P. J. vd Wel, F. C. Voogt, F. Swartjes, Kirsten Weide-Zaage
Reliability of Wafer Level Chip Scale Packages. Microelectron. Reliab. 54 (9-10) (2014)
Kirsten Weide-Zaage, Aymen Moujbani, Jörg Kludt
Simulation in 3D integration and TSV. LASCAS (2014)
Hélène Frémont, Jörg Kludt, Massar Wade, Kirsten Weide-Zaage, Isabelle Bord-Majek, Geneviève Duchamp
Qualification procedure for moisture in embedded capacitors. Microelectron. Reliab. 54 (9-10) (2014)
Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein, Christian Kovács
Degradation behavior in upstream/downstream via test structures. Microelectron. Reliab. 54 (9-10) (2014)
Aymen Moujbani, Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein, Lutz Meinshausen
Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects. Microelectron. Reliab. 53 (9-11) (2013)
Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano
solder joints on nickel gold pads. Microelectron. Reliab. 53 (9-11) (2013)
Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein
Dynamic simulation of octahedron slotted metal structures. Microelectron. Reliab. 53 (9-11) (2013)
Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont
Electro- and thermo-migration induced failure mechanisms in Package on Package. Microelectron. Reliab. 52 (12) (2012)
Markus Ackermann, Verena Hein, Christian Kovács, Kirsten Weide-Zaage
A design for robust wide metal tracks. Microelectron. Reliab. 52 (9-10) (2012)
Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein
layers on the thermal-electrical and mechanical behaviour of Al metallizations. Microelectron. Reliab. 52 (9-10) (2012)
Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage
Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers. Microelectron. Reliab. 52 (9-10) (2012)
Irina Bauer, Kirsten Weide-Zaage, Lutz Meinshausen
Influence of air gaps on the thermal-electrical-mechanical behavior of a copper metallization. Microelectron. Reliab. 51 (9-11) (2011)
Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont
Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps. Microelectron. Reliab. 51 (9-11) (2011)
Joharsyah Ciptokusumo, Kirsten Weide-Zaage, Oliver Aubel
Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling. Microelectron. Reliab. 49 (9-11) (2009)
Kirsten Weide-Zaage, Farzan Kashanchi, Oliver Aubel
Simulation of migration effects in nanoscaled copper metallizations. Microelectron. Reliab. 48 (8-9) (2008)
Kirsten Weide-Zaage, Jiani Zhao, Joharsyah Ciptokusumo, Oliver Aubel
Determination of migration effects in Cu-via structures with respect to process-induced stress. Microelectron. Reliab. 48 (8-9) (2008)
Kirsten Weide-Zaage, David Dalleau, Yves Danto, Hélène Frémont
Dynamic void formation in a DD-copper-structure with different metallization geometry. Microelectron. Reliab. 47 (2-3) (2007)
Kirsten Weide-Zaage, Walter Horaud, Hélène Frémont
Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations. Microelectron. Reliab. 45 (9-11) (2005)
Hélène Frémont, Jean-Yves Delétage, Kirsten Weide-Zaage, Yves Danto
How to study delamination in plastic encapsulated devices. Microelectron. Reliab. 44 (9-11) (2004)
David Dalleau, Kirsten Weide-Zaage, Yves Danto
Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures. Microelectron. Reliab. 43 (9-11) (2003)
David Dalleau, Kirsten Weide-Zaage
Three-Dimensional Voids Simulation in chip Metallization Structures: a Contribution to Reliability Evaluation. Microelectron. Reliab. 41 (9-10) (2001)