Mohd Faizul Mohd Sabri

Publication Activity (10 Years)

Years Active: 2012-2018
Publications (10 Years): 2

Top Topics

Mechanical Properties

High Temperature

Stainless Steel

Top Venues

Microelectron. Reliab.

Publications

Bakhtiar Ali, Mohd Faizul Mohd Sabri, Suhana Binti Mohd Said, Nazatul Liana Sukiman, Iswadi Jauhari, Mohammad Hossein Mahdavifard
Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment. Microelectron. Reliab. 82 (2018)
Bakhtiar Ali, Mohd Faizul Mohd Sabri, Iswadi Jauhari, Nazatul Liana Sukiman
Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5Cu lead-free solders. Microelectron. Reliab. 63 (2016)
Mohd Faizul Mohd Sabri, Nor Ilyana Muhd Nordin, Suhana Mohd Said, Nur Aishah Aminah Mohd Amin, Hamzah Arof, Iswadi Jauhari, Roziana Ramli, Kirsten Weide-Zaage
Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys. Microelectron. Reliab. 55 (9-10) (2015)
Mohammad Hossein Mahdavifard, Mohd Faizul Mohd Sabri, Dhafer Abdulameer Shnawah, Suhana Mohd Said, Irfan Anjum Badruddin, S. Rozali
The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn-1Ag-0.5Cu solder alloy. Microelectron. Reliab. 55 (9-10) (2015)
T. Tharsika, A. S. M. A. Haseeb, Sheikh A. Akbar, Mohd Faizul Mohd Sabri, Wong Yew Hoong
-Core/ZnO-Shell Nanostructures. Sensors 14 (8) (2014)
Nor Ilyana Muhd Nordin, Suhana Mohd Said, Roziana Ramli, Mohd Faizul Mohd Sabri, N. M. Sharif, N. A. F. N. M. Arifin, N. N. S. Ibrahim
Microstructure of Sn-1Ag-0.5Cu solder alloy bearing Fe under salt spray test. Microelectron. Reliab. 54 (9-10) (2014)
Dhafer Abdulameer Shnawah, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin
A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products. Microelectron. Reliab. 52 (1) (2012)
Dhafer Abdulameer Shnawah, Suhana Binti Mohd Said, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin, Fa Xing Che
Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products. Microelectron. Reliab. 52 (11) (2012)