Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment.
Bakhtiar AliMohd Faizul Mohd SabriSuhana Binti Mohd SaidNazatul Liana SukimanIswadi JauhariMohammad Hossein MahdavifardPublished in: Microelectron. Reliab. (2018)
Keyphrases
- mechanical properties
- high temperature
- finite element model
- finite element
- material properties
- thermal conductivity
- real time
- stainless steel
- mobile robot
- business intelligence
- experimental data
- electron microscopy
- boundary conditions
- desirable properties
- dynamic environments
- databases
- finite element analysis
- x ray
- diesel engine
- case study