Fa Xing Che

Publication Activity (10 Years)

Years Active: 2012-2016
Publications (10 Years): 1

Top Topics

Mechanical Properties

Energy Dissipation

Top Venues

Microelectron. Reliab.

Publications

Fa Xing Che, Xiaowu Zhang, Jong-Kai Lin
Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis. Microelectron. Reliab. 61 (2016)
Dhafer Abdulameer Shnawah, Suhana Binti Mohd Said, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin, Fa Xing Che
Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products. Microelectron. Reliab. 52 (11) (2012)