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Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis.

Fa Xing CheXiaowu ZhangJong-Kai Lin
Published in: Microelectron. Reliab. (2016)
Keyphrases
  • high density
  • finite element analysis
  • high speed
  • low cost
  • finite element
  • single image
  • empirical analysis
  • finite element model
  • solar cell
  • case study
  • relational databases