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Jong-Kai Lin
Publication Activity (10 Years)
Years Active: 2015-2016
Publications (10 Years): 2
Top Topics
High Density
Plasma Etching
Semiconductor Devices
Finite Element Analysis
Top Venues
IEEE Des. Test
Microelectron. Reliab.
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Publications
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Fa Xing Che
,
Xiaowu Zhang
,
Jong-Kai Lin
Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis.
Microelectron. Reliab.
61 (2016)
Guruprasad Katti
,
S. W. Ho
,
Li Hong Yu
,
Songbai Zhang
,
Rahul Dutta
,
Roshan Weerasekera
,
Ka-Fai Chang
,
Jong-Kai Lin
,
Srinivasa Rao Vempati
,
Surya Bhattacharya
Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI).
IEEE Des. Test
32 (4) (2015)