Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI).
Guruprasad KattiS. W. HoLi Hong YuSongbai ZhangRahul DuttaRoshan WeerasekeraKa-Fai ChangJong-Kai LinSrinivasa Rao VempatiSurya BhattacharyaPublished in: IEEE Des. Test (2015)
Keyphrases
- low cost
- high density
- low power
- plasma etching
- semiconductor devices
- cost effective
- high speed
- robotic control
- digital camera
- hardware and software
- real time
- tactile sensing
- integrated circuit
- silicon on insulator
- printed circuit boards
- electron microscopy
- visually guided
- highly efficient
- data acquisition
- metal oxide semiconductor
- genetic algorithm
- parallel processing
- digital images
- three dimensional