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Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products.

Dhafer Abdulameer ShnawahSuhana Binti Mohd SaidMohd Faizul Mohd SabriIrfan Anjum BadruddinFa Xing Che
Published in: Microelectron. Reliab. (2012)
Keyphrases
  • mechanical properties
  • finite element model
  • energy dissipation
  • finite element
  • mobile devices
  • mobile phone
  • electron microscopy
  • material properties
  • context aware
  • control system
  • low power
  • mobile users
  • mobile networks