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A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products.
Dhafer Abdulameer Shnawah
Mohd Faizul Mohd Sabri
Irfan Anjum Badruddin
Published in:
Microelectron. Reliab. (2012)
Keyphrases
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high temperature
failure rate
customer reviews
global optimization
design automation
infrared
particle swarm optimization
lightweight
product reviews
product quality
access control
simplex method
thermal conductivity