R. Roucou

Publication Activity (10 Years)

Years Active: 2014-2014
Publications (10 Years): 0

Top Topics

Printed Circuit Boards

Simulation Environment

Scale Invariant

Top Venues

Microelectron. Reliab.

Publications

Kirsten Weide-Zaage, J. Schlobohm, R. T. H. Rongen, F. C. Voogt, R. Roucou
Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core. Microelectron. Reliab. 54 (6-7) (2014)
R. T. H. Rongen, R. Roucou, P. J. vd Wel, F. C. Voogt, F. Swartjes, Kirsten Weide-Zaage
Reliability of Wafer Level Chip Scale Packages. Microelectron. Reliab. 54 (9-10) (2014)