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Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core.
Kirsten Weide-Zaage
J. Schlobohm
R. T. H. Rongen
F. C. Voogt
R. Roucou
Published in:
Microelectron. Reliab. (2014)
Keyphrases
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printed circuit boards
mechanical properties
neural network
low cost
simulation model
real time
mathematical model
numerical simulations
high density
simulation environment
high speed
signal processing
x ray
data acquisition
finite element model