R. T. H. Rongen

Publication Activity (10 Years)

Years Active: 2011-2015
Publications (10 Years): 0

Top Topics

Printed Circuit Boards

Storage Management

Top Venues

Microelectron. Reliab.

Publications

Kirsten Rongen, A. Mavinkurve, M. Chen, P. J. van der Wel, F. Swartjes, R. T. H. Rongen
Moisture absorption and desorption in wafer level chip scale packages. Microelectron. Reliab. 55 (9-10) (2015)
Kirsten Weide-Zaage, J. Schlobohm, R. T. H. Rongen, F. C. Voogt, R. Roucou
Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core. Microelectron. Reliab. 54 (6-7) (2014)
R. T. H. Rongen, R. Roucou, P. J. vd Wel, F. C. Voogt, F. Swartjes, Kirsten Weide-Zaage
Reliability of Wafer Level Chip Scale Packages. Microelectron. Reliab. 54 (9-10) (2014)
A. Mavinkurve, Leon Goumans, G. M. O'Halloran, R. T. H. Rongen, M.-L. Farrugia
Copper wire interconnect reliability evaluation using in-situ High Temperature Storage Life (HTSL) tests. Microelectron. Reliab. 54 (9-10) (2014)
R. T. H. Rongen, A. van IJzerloo, C. Cotofana, K. M. Lan
Cratering response method to study the effect of ultrasonic energy on Cu-wire bonding quality. Microelectron. Reliab. 51 (9-11) (2011)