P. J. van der Wel

Publication Activity (10 Years)

Years Active: 2001-2015
Publications (10 Years): 2

Top Topics

High Temperature

Signal Processing

Top Venues

Microelectron. Reliab.

Publications

Maximilian Dammann, Martina Baeumler, Peter Brückner, Wolfgang Bronner, Stephan Maroldt, Helmer Konstanzer, Matthias Wespel, Rüdiger Quay, Michael Mikulla, Andreas Graff, M. Lorenzini, M. Fagerlind, P. J. van der Wel, T. Rödle
Degradation of 0.25 μm GaN HEMTs under high temperature stress test. Microelectron. Reliab. 55 (9-10) (2015)
Kirsten Rongen, A. Mavinkurve, M. Chen, P. J. van der Wel, F. Swartjes, R. T. H. Rongen
Moisture absorption and desorption in wafer level chip scale packages. Microelectron. Reliab. 55 (9-10) (2015)
P. J. van der Wel, T. Rödle, Benoit Lambert, Hervé Blanck, Maximilian Dammann
Qualification of 50 V GaN on SiC technology for RF power amplifiers. Microelectron. Reliab. 53 (9-11) (2013)
Maximilian Dammann, W. Pletschen, Patrick Waltereit, Wolfgang Bronner, Rüdiger Quay, Stefan Müller, Michael Mikulla, Oliver Ambacher, P. J. van der Wel, S. Murad, T. Rödle, R. Behtash, F. Bourgeois, K. Riepe, Martin Fagerlind, Einar Örn Sveinbjörnsson
Reliability and degradation mechanism of AlGaN/GaN HEMTs for next generation mobile communication systems. Microelectron. Reliab. 49 (5) (2009)
P. J. van der Wel, J. R. de Beer, R. J. M. van Boxtel, Y. Y. Hsieh, Y. C. Wang
metal-insulator-metal capacitors. Microelectron. Reliab. 47 (8) (2007)
P. J. van der Wel, S. J. C. H. Theeuwen, J. A. Bielen, Y. Li, R. A. van den Heuvel, J. G. Gommans, F. van Rijs, P. Bron, H. J. F. Peuscher
Wear out failure mechanisms in aluminium and gold based LDMOS RF power applications. Microelectron. Reliab. 46 (8) (2006)
Zoran Radivojevic, K. Andersson, J. A. Bielen, P. J. van der Wel, J. Rantala
Operating limits for RF power amplifiers at high junction temperatures. Microelectron. Reliab. 44 (6) (2004)
Kris Croes, R. Dreesen, Jean Manca, Ward De Ceuninck, Luc De Schepper, Luc Tielemans, P. J. van der Wel
High-resolution in-situ of gold electromigration: test time reduction. Microelectron. Reliab. 41 (9-10) (2001)