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J. Schlobohm
Publication Activity (10 Years)
Years Active: 2014-2014
Publications (10 Years): 0
Top Topics
Simulation Environment
High Density
X Ray
Mechanical Properties
Top Venues
Microelectron. Reliab.
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Publications
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Kirsten Weide-Zaage
,
J. Schlobohm
,
R. T. H. Rongen
,
F. C. Voogt
,
R. Roucou
Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core.
Microelectron. Reliab.
54 (6-7) (2014)