Verena Hein

Publication Activity (10 Years)

Years Active: 2012-2016
Publications (10 Years): 1

Top Topics

Integrated Circuit

Electrical Properties

Top Venues

Microelectron. Reliab.

Publications

Verena Hein, Marco Erstling, Raj Sekar Sethu, Kirsten Weide-Zaage, Tianlin Bai
Reliability evaluation of tungsten donut-via as an element of the highly robust metallization. Microelectron. Reliab. 64 (2016)
Verena Hein, Jörg Kludt, Kirsten Weide-Zaage
Evaluation new corner stress relief structure layout for high robust metallization. Microelectron. Reliab. 54 (9-10) (2014)
Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein, Christian Kovács
Degradation behavior in upstream/downstream via test structures. Microelectron. Reliab. 54 (9-10) (2014)
Aymen Moujbani, Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein, Lutz Meinshausen
Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects. Microelectron. Reliab. 53 (9-11) (2013)
Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein
Dynamic simulation of octahedron slotted metal structures. Microelectron. Reliab. 53 (9-11) (2013)
Markus Ackermann, Verena Hein, Christian Kovács, Kirsten Weide-Zaage
A design for robust wide metal tracks. Microelectron. Reliab. 52 (9-10) (2012)
Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein
layers on the thermal-electrical and mechanical behaviour of Al metallizations. Microelectron. Reliab. 52 (9-10) (2012)