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Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling.

Joharsyah CiptokusumoKirsten Weide-ZaageOliver Aubel
Published in: Microelectron. Reliab. (2009)
Keyphrases
  • mechanical properties
  • stress distribution
  • three dimensional
  • neural network
  • case study
  • relational databases
  • probability distribution
  • numerical simulations