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Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage.
Maxime Berthou
P. Retailleau
Hélène Frémont
Alexandrine Guédon-Gracia
C. Jéphos-Davennel
Published in:
Microelectron. Reliab. (2009)
Keyphrases
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high temperature
thermal conductivity
infrared
mechanical properties
composite materials
power plant
solder ball connect
global optimization
thermal imaging
real time
database systems
path planning
file system
data storage
storage space