Nicolas Bresson

Publication Activity (10 Years)

Years Active: 2016-2021
Publications (10 Years): 5

Top Topics

Information Integration

Fully Integrated

Semiconductor Devices

Top Venues

Publications

C. Dubarry, L. Arnaud, M. L. Calvo Munoz, Gaëlle Mauguen, S. Moreau, R. Crochemore, Nicolas Bresson, Bernard Aventurier
3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. 3DIC (2021)
Emilie Bourjot, Paul Stewart, C. Dubarry, E. Lagoutte, E. Rolland, Nicolas Bresson, G. Romano, D. Scevola, Viorel Balan, Jérôme Dechamp, Marc Zussy, Gaëlle Mauguen, Clément Castan, Loïc Sanchez, Amadine Jouve, Frank Fournel, Séverine Cheramy
Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. 3DIC (2019)
Amadine Jouve, Loïc Sanchez, Clément Castan, Nicolas Bresson, Frank Fournel, Nicolas Raynaud, Pascal Metzger
Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields. 3DIC (2019)
Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, V. Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. IRPS (2018)
Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau, Karim Azizi-Mourier, C. Chantre, Pascal Vivet, Gaël Pillonnet, F. Casset, F. Ponthenier, Alexis Farcy, S. Lhostis, Jean Michailos, Alexandre Arriordaz, Séverine Cheramy
ITAC: A complete 3D integration test platform. 3DIC (2016)