Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development.
Emilie BourjotPaul StewartC. DubarryE. LagoutteE. RollandNicolas BressonG. RomanoD. ScevolaViorel BalanJérôme DechampMarc ZussyGaëlle MauguenClément CastanLoïc SanchezAmadine JouveFrank FournelSéverine CheramyPublished in: 3DIC (2019)