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Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields.
Amadine Jouve
Loïc Sanchez
Clément Castan
Nicolas Bresson
Frank Fournel
Nicolas Raynaud
Pascal Metzger
Published in:
3DIC (2019)
Keyphrases
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high accuracy
high precision
wide range
prediction accuracy
database
information systems
highly accurate
real time
neural network
error rate
precision and recall