Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.

Lucile Arnaud Stéphane Moreau Amadine Jouve Imed Jani Didier Lattard F. Fournel C. Euvrard Y. Exbrayat V. Balan Nicolas Bresson S. Lhostis J. Jourdon E. Deloffre S. Guillaumet Alexis Farcy Simon Gousseau M. Arnoux

Published in: IRPS (2018)

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