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3D interconnection using copper direct hybrid bonding for GaN on silicon wafer.
C. Dubarry
L. Arnaud
M. L. Calvo Munoz
Gaëlle Mauguen
S. Moreau
R. Crochemore
Nicolas Bresson
Bernard Aventurier
Published in:
3DIC (2021)
Keyphrases
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high density
semiconductor devices
magnetic recording
thin film
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semiconductor manufacturing
integrated circuit
high speed
artificial intelligence
massively parallel
electron beam
field effect transistors