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200°C direct bonding copper interconnects : Electrical results and reliability.

Léa Di CioccioRachid TaibiCédrick ChappazStéphane MoreauLaurent-Luc ChapelonThomas Signamarcheix
Published in: 3DIC (2011)
Keyphrases
  • printed circuit boards
  • input output
  • thin film
  • power distribution
  • multichip module
  • power grid
  • transmission line
  • data sets
  • databases
  • failure rate
  • lower cost
  • reliability assessment