Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield.
S. MermozLoic SanchezLéa Di CioccioJ. BerthierE. DeloffreC. FretignyPublished in: 3DIC (2011)
Keyphrases
- high precision
- detection algorithm
- high accuracy
- probabilistic model
- data sets
- support vector machine
- experimental evaluation
- neural network
- synthetic data
- low cost
- preprocessing
- dynamic programming
- significant improvement
- support vector machine svm
- objective function
- multiscale
- image segmentation
- integrated circuit