Using TSVs for thermal mitigation in 3D circuits: Wish and truth.
Cristiano SantosPapa Momar SouareFrançois de CrecyPerceval CoudrainJean-Philippe ColonnaPascal VivetAndras BorbelyRicardo ReisM. Haykel Ben JamaaVincent FioriAlexis FarcyPublished in: 3DIC (2014)
Keyphrases
- infrared
- high speed
- delay insensitive
- visible spectrum
- power plant
- circuit design
- analog circuits
- truth values
- solder ball connect
- thermal conductivity
- risk management
- digital circuits
- thermal images
- computer vision
- tunnel diode
- finite element analysis
- case study
- logic synthesis
- analog vlsi
- injection lasers
- learning algorithm