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Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning.
Imed Jani
Didier Lattard
Pascal Vivet
Jean Durupt
Sébastien Thuries
Edith Beigné
Published in:
ETS (2019)
Keyphrases
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high density
low density
close proximity
high power
data center
magnetic recording
power consumption
high bandwidth
logic programming
low power
data transmission
thin film
input output
magnetic tape
error correction
integrated circuit
multi valued
mathematical analysis
test cases
random access memory
low cost