Innovative structures to test bonding alignment and characterize high density interconnects in 3D-IC.
Imed JaniDidier LattardPascal VivetEdith BeignéPublished in: NEWCAS (2017)
Keyphrases
- high density
- low density
- field effect transistors
- close proximity
- high power
- high bandwidth
- thin film
- data center
- magnetic recording
- integrated circuit
- magnetic tape
- test cases
- real time
- statistical tests
- input output
- statistical significance
- image alignment
- computer simulation
- particle filter
- pairwise
- data mining
- fiber optic
- neural network