Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement.
Amadine JouveY. SinquinArnaud GarnierM. DavalPascal ChausseM. ArgoudN. AlloutiLaurence BaudJérôme DechampR. FraniatteSéverine CheramyH. KatoK. KondoPublished in: 3DIC (2015)