Login / Signup

Stress management strategy to limit die curvature during silicon interposer integration.

Benjamin VianneAlexis FarcyVincent FioriCédrick ChappazNorbert ChevrierG. LobascioPascal ChausseF. PonthenierA. RucklyStephanie EscoubasOlivier Thomas
Published in: 3DIC (2015)
Keyphrases
  • low cost
  • curvature estimation
  • databases
  • high speed
  • scale space
  • data integration
  • learning algorithm
  • image processing
  • three dimensional
  • information integration
  • high density