Valeriy Sukharev

Publication Activity (10 Years)

Years Active: 2001-2024
Publications (10 Years): 24

Top Topics

Environmentally Friendly

Programmable Logic

Interaction Effects

Top Venues

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.

Publications

Yong Hyeon Yi, Chris H. Kim, Armen Kteyan, Alexander Volkov, Stéphane Moreau, Valeriy Sukharev
Electromigration Test Chip Experiments from Realistic Power Grid Structures: Failure Trend Comparison and Statistical Analysis. IRPS (2024)
Jun-Ho Choy, Stéphane Moreau, Catherine Brunet-Manquat, Valeriy Sukharev, Armen Kteyan
Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects. ISPD (2024)
Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, J. Shuster-Passage, Seungman Choi, M. Gall
A Unified Physics-Based Stochastic Model for EM-Induced Resistance Degradation in BEoL Interconnect Segments. IRPS (2024)
J. Shuster-Passage, S. Abdel Razek, M. Mattoo, Meike Hauschildt, Seungman Choi, Martin Gall, Armen Kteyan, Jun-Ho Choy, Valeriy Sukharev, Matthias Kraatz, J. R. Lloyd
A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses. IRPS (2024)
Armen Kteyan, Valeriy Sukharev, Alexander Volkov, Jun-Ho Choy, Farid N. Najm, Yong Hyeon Yi, Chris H. Kim, Stéphane Moreau
Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution. ISPD (2023)
Yong Hyeon Yi, Chris H. Kim, Chen Zhou, Armen Kteyan, Valeriy Sukharev
Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters. IRPS (2023)
Armen Kteyan, Valeriy Sukharev, Y. Yi, C. Kim
Novel methodology for temperature-aware electromigration assessment in on-chip power grid: simulations and experimental validation (Invited). IRPS (2022)
Armen Kteyan, Jun-Ho Choy, Valeriy Sukharev, Massimo Bertoletti, Carmelo Maiorca, Rossana Zadra, Massimo Inzaghi, Gabriele Gattere, Giancarlo Zinco, Paolo Valente, Roberto Bardelli, Alessandro Valerio, Pierluigi Rolandi, Mattia Monetti, Valentina Cuomo, Salvatore Santapa
Novel Methodology for Assessing Chip-Package Interaction Effects onChip Performance. ISPD (2022)
Valeriy Sukharev, Armen Kteyan, Farid N. Najm, Yong Hyeon Yi, Chris H. Kim, Jun-Ho Choy, Sofya Torosyan, Yu Zhu
Experimental Validation of a Novel Methodology for Electromigration Assessment in On-Chip Power Grids. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41 (11) (2022)
Adam Issa, Valeriy Sukharev, Farid N. Najm
Electromigration Checking Using a Stochastic Effective Current Model. ICCAD (2020)
Armen Kteyan, Henrik Hovsepyan, Jun-Ho Choy, Valeriy Sukharev
Assesment of CPI Stress Impact on IC Reliability and Performance in 2.5D/3D Packages. IRPS (2019)
Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy
An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems. 3DIC (2019)
Farid N. Najm, Valeriy Sukharev
Efficient Simulation of Electromigration Damage in Large Chip Power Grids Using Accurate Physical Models (Invited Paper). IRPS (2019)
Zahi Moudallal, Valeriy Sukharev, Farid N. Najm
Power Grid Fixing for Electromigration-induced Voltage Failures. ICCAD (2019)
Sandeep Chatterjee, Valeriy Sukharev, Farid N. Najm
Power Grid Electromigration Checking Using Physics-Based Models. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 37 (7) (2018)
Xin Huang, Valeriy Sukharev, Taeyoung Kim, Sheldon X.-D. Tan
Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing. Integr. 58 (2017)
Sandeep Chatterjee, Valeriy Sukharev, Farid N. Najm
Fast physics-based electromigration assessment by efficient solution of linear time-invariant (LTI) systems. ICCAD (2017)
Xin Huang, Valeriy Sukharev, Jun-Ho Choy, Marko Chew, Taeyoung Kim, Sheldon X.-D. Tan
Electromigration assessment for power grid networks considering temperature and thermal stress effects. Integr. 55 (2016)
Sandeep Chatterjee, Valeriy Sukharev, Farid N. Najm
Fast physics-based electromigration checking for on-die power grids. ICCAD (2016)
Xin Huang, Valeriy Sukharev, Zhongdong Qi, Taeyoung Kim, Sheldon X.-D. Tan
Physics-based full-chip TDDB assessment for BEOL interconnects. DAC (2016)
Taeyoung Kim, Xin Huang, Hai-Bao Chen, Valeriy Sukharev, Sheldon X.-D. Tan
Learning-based dynamic reliability management for dark silicon processor considering EM effects. DATE (2016)
Xin Huang, Valeriy Sukharev, Taeyoung Kim, Hai-Bao Chen, Sheldon X.-D. Tan
Electromigration recovery modeling and analysis under time-dependent current and temperature stressing. ASP-DAC (2016)
Xin Huang, Armen Kteyan, Sheldon X.-D. Tan, Valeriy Sukharev
Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35 (11) (2016)
Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang, Taeyoung Kim, Valeriy Sukharev
Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35 (11) (2016)
Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang, Valeriy Sukharev
New electromigration modeling and analysis considering time-varying temperature and current densities. ASP-DAC (2015)
Jun-Ho Choy, Valeriy Sukharev, Armen Kteyan, Henrik Hovsepyan, Ramnath Venkatraman, Ruggero Castagnetti
Post placement leakage reduction with stress-enhanced filler cells. ISLPED (2015)
Hai-Bao Chen, Sheldon X.-D. Tan, Valeriy Sukharev, Xin Huang, Taeyoung Kim
Interconnect reliability modeling and analysis for multi-branch interconnect trees. DAC (2015)
Taeyoung Kim, Bowen Zheng, Hai-Bao Chen, Qi Zhu, Valeriy Sukharev, Sheldon X.-D. Tan
Lifetime optimization for real-time embedded systems considering electromigration effects. ICCAD (2014)
Xin Huang, Tan Yu, Valeriy Sukharev, Sheldon X.-D. Tan
Physics-based Electromigration Assessment for Power Grid Networks. DAC (2014)
Valeriy Sukharev, Xin Huang, Hai-Bao Chen, Sheldon X.-D. Tan
IR-drop based electromigration assessment: parametric failure chip-scale analysis. ICCAD (2014)
Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy, Henrik Hovsepyan, Ara Markosian, Ehrenfried Zschech, Rene Huebner
Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance. J. Electron. Test. 28 (1) (2012)
Vivek Joshi, Valeriy Sukharev, Andres Torres, Kanak Agarwal, Dennis Sylvester, David T. Blaauw
Closed-form modeling of layout-dependent mechanical stress. DAC (2010)
Valeriy Sukharev, Ara Markosian, Armen Kteyan, Levon Manukyan, Nikolay Khachatryan, Jun-Ho Choy, Hasmik Lazaryan, Henrik Hovsepyan, Seiji Onoue, Takuo Kikuchi, Tetsuya Kamigaki
Control of design specific variation in etch-assisted via pattern transfer by means of full-chip simulation. ISQED (2009)
Valeriy Sukharev
Physically based simulation of electromigration-induced degradation mechanisms in dual-inlaid copper interconnects. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 24 (9) (2005)
Valeriy Sukharev
Physically-Based Simulation of Electromigration Induced Failures in Copper Dual-Damascene Interconnect. ISQED (2004)
Valeriy Sukharev, Ben P. Shieh, Ratan K. Choudhury, Chong W. Park, Krishna C. Saraswat
Reliability Studies on Multilevel Interconnection with Intermetal Dielectric Air Gaps. Microelectron. Reliab. 41 (9-10) (2001)