Krishna C. Saraswat

Publication Activity (10 Years)

Years Active: 2001-2024
Publications (10 Years): 7

Top Topics

Intravascular Ultrasound

Silicon Nitride

Electrical Properties

Top Venues

Publications

Eros Reato, P. Palacios, J. A. Yang, S. Wahid, Marc Jaikissoon, J.-S. Ko, Alwin Daus, M. Saeed, Krishna C. Saraswat, Renato Negra, Eric Pop, Max Christian Lemme
Nanoscale MoS2 Transistors on Polyimide for Radio-Frequency Operation. DRC (2024)
Jung-Soo Ko, Zichen Zhang, Sol Lee, Marc Jaikissoon, Robert K. A. Bennett, Kwanpyo Kim, Andrew C. Kummel, Prabhakar Bandaru, Eric Pop, Krishna C. Saraswat
Ultrathin Gate Dielectric Enabled by Nanofog Aluminum Oxide on Monolayer MoS2. ESSDERC (2023)
Marc Jaikissoon, Jung-Soo Ko, Eric Pop, Krishna C. Saraswat
Local Back-Gate Monolayer MoS2 Transistors with Channel Lengths Down to 50 nm and EOT ∼ 1 nm Showing Improved $I_{\text{on}}$ using Post-Metal Anneal. DRC (2023)
Lauren Hoang, Alwin Daus, Sumaiya Wahid, Jimin Kwon, Jung-Soo Ko, Shengjun Qin, Mahnaz Islam, Krishna C. Saraswat, H.-S. Philip Wong, Eric Pop
Bias Stress Stability of ITO Transistors and its Dependence on Dielectric Properties. DRC (2022)
Marc Jaikissoon, Jerry A. Yang, Kathryn M. Neilson, Eric Pop, Krishna C. Saraswat
Mobility Enhancement of Monolayer MoS2 Transistors using Tensile-Stressed Silicon Nitride Capping Layers. DRC (2022)
Sumaiya Wahid, Alwin Daus, Jimin Kwon, Shengjun Qin, Jung-Soo Ko, Krishna C. Saraswat, H.-S. Philip Wong, Eric Pop
First Demonstration of Top-Gated ITO Transistors: Effect of Channel Passivation. DRC (2022)
Junkyo Suh, Andrew C. Meng, Marc Jaikissoon, Michael Braun, Taeho R. Kim, Ann F. Marshall, Anahita Pakzad, Paul C. McIntyre, Krishna C. Saraswat
3D-stacked Strained SiGe/Ge Gate-All-Around (GAA) Structure Fabricated by 3D Ge Condensation. DRC (2019)
Valeriy Sukharev, Ben P. Shieh, Ratan K. Choudhury, Chong W. Park, Krishna C. Saraswat
Reliability Studies on Multilevel Interconnection with Intermetal Dielectric Air Gaps. Microelectron. Reliab. 41 (9-10) (2001)
Kaustav Banerjee, Shukri J. Souri, Pawan Kapur, Krishna C. Saraswat
3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration. Proc. IEEE 89 (5) (2001)
Jeffery A. Davis, Raguraman Venkatesan, Alan Kaloyeros, Michael Beylansky, Shukri J. Souri, Kaustav Banerjee, Krishna C. Saraswat, Arifur Rahman, Rafael Reif, James D. Meindl
Interconnect limits on gigascale integration (GSI) in the 21st century. Proc. IEEE 89 (3) (2001)