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3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration.

Kaustav BanerjeeShukri J. SouriPawan KapurKrishna C. Saraswat
Published in: Proc. IEEE (2001)
Keyphrases
  • chip design
  • high speed
  • power dissipation
  • management system
  • distributed systems
  • relational databases
  • physical design
  • neural network
  • expert systems
  • user interface
  • computer systems