J. R. Lloyd

Publication Activity (10 Years)

Years Active: 2004-2024
Publications (10 Years): 3

Top Topics

Comparative Study

Top Venues

Publications

J. Shuster-Passage, S. Abdel Razek, M. Mattoo, Meike Hauschildt, Seungman Choi, Martin Gall, Armen Kteyan, Jun-Ho Choy, Valeriy Sukharev, Matthias Kraatz, J. R. Lloyd
A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses. IRPS (2024)
Niaz Mahmud, Nabihah Azhari, J. R. Lloyd
Comparative Study of TDDB Models on BEOL Interconnects for Sub-20 nm Spacings. IRPS (2019)
J. M. Passage, N. Azhari, J. R. Lloyd
Stress Migration Followed by Electromigration Reliability Testing. IRPS (2019)
J. R. Lloyd, N. A. Connelly, Xiaoli He, K. J. Ryan, B. H. Wood
Fast diffusers in a thermal gradient (solder ball). Microelectron. Reliab. 50 (9-11) (2010)
J. R. Lloyd
Black's law revisited - Nucleation and growth in electromigration failure. Microelectron. Reliab. 47 (9-11) (2007)
J. R. Lloyd, C. E. Murray, S. Ponoth, S. Cohen, E. Liniger
The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics. Microelectron. Reliab. 46 (9-11) (2006)
J. R. Lloyd, M. R. Lane, X.-H. Liu, E. Liniger, T. M. Shaw, C.-K. Hu, R. Rosenberg
Reliability Challenges with Ultra-Low k Interlevel Dielectrics. Microelectron. Reliab. 44 (9-11) (2004)
J. R. Lloyd, E. Liniger, S. T. Chen
Time dependent dielectric breakdown in a low-k interlevel dielectric. Microelectron. Reliab. 44 (9-11) (2004)