Jun-Ho Choy

Publication Activity (10 Years)

Years Active: 2009-2024
Publications (10 Years): 10

Top Topics

Stochastic Model

Interaction Effects

Top Venues

Publications

Jun-Ho Choy, Stéphane Moreau, Catherine Brunet-Manquat, Valeriy Sukharev, Armen Kteyan
Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects. ISPD (2024)
Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, J. Shuster-Passage, Seungman Choi, M. Gall
A Unified Physics-Based Stochastic Model for EM-Induced Resistance Degradation in BEoL Interconnect Segments. IRPS (2024)
J. Shuster-Passage, S. Abdel Razek, M. Mattoo, Meike Hauschildt, Seungman Choi, Martin Gall, Armen Kteyan, Jun-Ho Choy, Valeriy Sukharev, Matthias Kraatz, J. R. Lloyd
A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses. IRPS (2024)
Armen Kteyan, Valeriy Sukharev, Alexander Volkov, Jun-Ho Choy, Farid N. Najm, Yong Hyeon Yi, Chris H. Kim, Stéphane Moreau
Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution. ISPD (2023)
Armen Kteyan, Jun-Ho Choy, Valeriy Sukharev, Massimo Bertoletti, Carmelo Maiorca, Rossana Zadra, Massimo Inzaghi, Gabriele Gattere, Giancarlo Zinco, Paolo Valente, Roberto Bardelli, Alessandro Valerio, Pierluigi Rolandi, Mattia Monetti, Valentina Cuomo, Salvatore Santapa
Novel Methodology for Assessing Chip-Package Interaction Effects onChip Performance. ISPD (2022)
Valeriy Sukharev, Armen Kteyan, Farid N. Najm, Yong Hyeon Yi, Chris H. Kim, Jun-Ho Choy, Sofya Torosyan, Yu Zhu
Experimental Validation of a Novel Methodology for Electromigration Assessment in On-Chip Power Grids. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41 (11) (2022)
Armen Kteyan, Henrik Hovsepyan, Jun-Ho Choy, Valeriy Sukharev
Assesment of CPI Stress Impact on IC Reliability and Performance in 2.5D/3D Packages. IRPS (2019)
Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy
An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems. 3DIC (2019)
Xin Huang, Valeriy Sukharev, Jun-Ho Choy, Marko Chew, Taeyoung Kim, Sheldon X.-D. Tan
Electromigration assessment for power grid networks considering temperature and thermal stress effects. Integr. 55 (2016)
Jun-Ho Choy, Valeriy Sukharev, Armen Kteyan, Henrik Hovsepyan, Ramnath Venkatraman, Ruggero Castagnetti
Post placement leakage reduction with stress-enhanced filler cells. ISLPED (2015)
Marko Chew, Ara Aslyan, Jun-Ho Choy, Xin Huang
Accurate full-chip estimation of power map, current densities and temperature for EM assessment. ICCAD (2014)
Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy, Henrik Hovsepyan, Ara Markosian, Ehrenfried Zschech, Rene Huebner
Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance. J. Electron. Test. 28 (1) (2012)
Valeriy Sukharev, Ara Markosian, Armen Kteyan, Levon Manukyan, Nikolay Khachatryan, Jun-Ho Choy, Hasmik Lazaryan, Henrik Hovsepyan, Seiji Onoue, Takuo Kikuchi, Tetsuya Kamigaki
Control of design specific variation in etch-assisted via pattern transfer by means of full-chip simulation. ISQED (2009)