Sheldon X.-D. Tan

ORCID

Publication Activity (10 Years)

Years Active: 2000-2024
Publications (10 Years): 134

Top Venues

ICCAD

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.

ASP-DAC

IEEE Trans. Very Large Scale Integr. Syst.

Publications

Maliha Tasnim, Sachin Sachdeva, Yibo Liu, Sheldon X.-D. Tan
Hybrid Temporal Computing for Lower Power Hardware Accelerators. CoRR (2024)
Maliha Tasnim, Chinmay Raje, Sheldon X.-D. Tan
Multi-ALM: Run-time Multi-Level Reconfigurable Approximate Logarithmic Multiplier. ISQED (2024)
Yibo Liu, Sheldon X.-D. Tan
GridVAE: Fast Power Grid EM-Aware IR Drop Prediction and Fixing Accelerated by Variational AutoEncoder. ISQED (2024)
Yibo Liu, Shuyuan Yu, Maliha Tasnim, Sheldon X.-D. Tan
Fast and Scaled Counting-Based Stochastic Computing Divider Design. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43 (8) (2024)
Sachin Sachdeva, Jincong Lu, Hussam Amrouch, Sheldon X.-D. Tan
Exploring BTI aging effects on spatial power density and temperature profiles of VLSI chips. Integr. 97 (2024)
Shuyuan Yu, Sheldon X.-D. Tan
PAALM: Power Density Aware Approximate Logarithmic Multiplier Design. ASP-DAC (2023)
Maliha Tasnim, Chinmay Raje, Shuyuan Yu, Elaheh Sadredini, Sheldon X.-D. Tan
MAGIC-DHT: Fast in-memory computing for Discrete Hadamard Transform. Integr. 93 (2023)
Jincong Lu, Jinwei Zhang, Sheldon X.-D. Tan
Real-time Thermal Map Estimation for AMD Multi-Core CPUs Using Transformer. ICCAD (2023)
Han Zhou, Yibo Liu, Wentian Jin, Sheldon X.-D. Tan
GridNetOpt: Fast Full-Chip EM-Aware Power Grid Optimization Accelerated by Deep Neural Networks. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42 (5) (2023)
Liang Chen, Jincong Lu, Wentian Jin, Sheldon X.-D. Tan
Fast Full-Chip Parametric Thermal Analysis Based on Enhanced Physics Enforced Neural Networks. ICCAD (2023)
Jinwei Zhang, Sheriff Sadiqbatcha, Sheldon X.-D. Tan
Hot-Trim: Thermal and Reliability Management for Commercial Multicore Processors Considering Workload Dependent Hot Spots. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42 (7) (2023)
Jinwei Zhang, Sheriff Sadiqbatcha, Liang Chen, Cuong Thi, Sachin Sachdeva, Hussam Amrouch, Sheldon X.-D. Tan
Hot-spot aware thermoelectric array based cooling for multicore processors. Integr. 89 (2023)
Jincong Lu, Jinwei Zhang, Wentian Jin, Sachin Sachdeva, Sheldon X.-D. Tan
Learning Based Spatial Power Characterization and Full-Chip Power Estimation for Commercial TPUs. ASP-DAC (2023)
Liang Chen, Wentian Jin, Jinwei Zhang, Sheldon X.-D. Tan
Thermoelectric Cooler Modeling and Optimization via Surrogate Modeling Using Implicit Physics-Constrained Neural Networks. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42 (11) (2023)
Liang Chen, Wentian Jin, Mohammadamir Kavousi, Subed Lamichhane, Sheldon X.-D. Tan
Linear Time Electromigration Analysis Based on Physics-Informed Sparse Regression. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42 (11) (2023)
Sachin Sachdeva, Jinwei Zhang, Hussam Amrouch, Sheldon X.-D. Tan
Long-Term Aging Impacts on Spatial On-Chip Power Density and Temperature. SMACD (2023)
Subed Lamichhane, Wentian Jin, Liang Chen, Mohammadamir Kavousi, Sheldon X.-D. Tan
PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks. ICCAD (2023)
Mohammadamir Kavousi, Liang Chen, Sheldon X.-D. Tan
Fast Electromigration Stress Analysis Considering Spatial Joule Heating Effects. ASP-DAC (2022)
Liang Chen, Wentian Jin, Sheldon X.-D. Tan
Fast Thermal Analysis for Chiplet Design based on Graph Convolution Networks. ASP-DAC (2022)
Marcus Chow, Ali Jahanshahi, Ana Cardenas Beltran, Sheldon X.-D. Tan, Daniel Wong
GPUCalorie: Floorplan Estimation for GPU Thermal Evaluation. ISPASS (2022)
Jinwei Zhang, Sheriff Sadiqbatcha, Michael O'Dea, Hussam Amrouch, Sheldon X.-D. Tan
Full-Chip Power Density and Thermal Map Characterization for Commercial Microprocessors Under Heat Sink Cooling. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41 (5) (2022)
Liang Chen, Sheriff Sadiqbatcha, Hussam Amrouch, Sheldon X.-D. Tan
Electrothermal Simulation and Optimal Design of Thermoelectric Cooler Using Analytical Approach. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41 (9) (2022)
Wentian Jin, Liang Chen, Subed Lamichhane, Mohammadamir Kavousi, Sheldon X.-D. Tan
HierPINN-EM: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnects Using Hierarchical Physics-Informed Neural Network. ICCAD (2022)
Sheldon X.-D. Tan
EDAML 2022 Invited Speaker 9: Thermal and Power Monitoring and Estimation for Commercial Multicore Processors - A Machine Learning Perspective. IPDPS Workshops (2022)
Shuyuan Yu, Maliha Tasnim, Sheldon X.-D. Tan
HEALM: Hardware-Efficient Approximate Logarithmic Multiplier with Reduced Error. ASP-DAC (2022)
Sheriff Sadiqbatcha, Jinwei Zhang, Hussam Amrouch, Sheldon X.-D. Tan
Real-Time Full-Chip Thermal Tracking: A Post-Silicon, Machine Learning Perspective. IEEE Trans. Computers 71 (6) (2022)
Shuyuan Yu, Sheldon X.-D. Tan
Scaled-CBSC: scaled counting-based stochastic computing multiplication for improved accuracy. DAC (2022)
Sheldon X.-D. Tan, Toshihiro Hattori
The 2021 Asia and South Pacific Design Automation Conference (ASPDAC). IEEE Des. Test 38 (3) (2021)
Xiaoyi Wang, Shaobin Ma, Sheldon X.-D. Tan, Chase Cook, Liang Chen, Jianlei Yang, Wenjian Yu
Fast Physics-Based Electromigration Analysis for Full-Chip Networks by Efficient Eigenfunction-Based Solution. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40 (3) (2021)
Wentian Jin, Liang Chen, Sheriff Sadiqbatcha, Shaoyi Peng, Sheldon X.-D. Tan
EMGraph: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnect Using Graph Convolution Networks. DAC (2021)
Sheriff Sadiqbatcha, Jinwei Zhang, Hengyang Zhao, Hussam Amrouch, Jörg Henkel, Sheldon X.-D. Tan
Post-Silicon Heat-Source Identification and Machine-Learning-Based Thermal Modeling Using Infrared Thermal Imaging. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40 (4) (2021)
Wentian Jin, Shaoyi Peng, Sheldon X.-D. Tan
Data-Driven Electrostatics Analysis based on Physics-Constrained Deep learning. DATE (2021)
Shuyuan Yu, Yibo Liu, Sheldon X.-D. Tan
Approximate Divider Design Based on Counting-Based Stochastic Computing Division. MLCAD (2021)
Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao
A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40 (2) (2021)
Hussam Amrouch, Animesh Basak Chowdhury, Wentian Jin, Ramesh Karri, Farshad Khorrami, Prashanth Krishnamurthy, Ilia Polian, Victor M. van Santen, Benjamin Tan, Sheldon X.-D. Tan
Special Session: Machine Learning for Semiconductor Test and Reliability. VTS (2021)
Shuyuan Yu, Yibo Liu, Sheldon X.-D. Tan
COSAIM: Counter-based Stochastic-behaving Approximate Integer Multiplier for Deep Neural Networks. DAC (2021)
Han Zhou, Liang Chen, Sheldon X.-D. Tan
Robust power grid network design considering EM aging effects for multi-segment wires. Integr. 77 (2021)
Subed Lamichhane, Shayoi Peng, Wentian Jin, Sheldon X.-D. Tan
Fast Electrostatic Analysis For VLSI Aging based on Generative Learning. MLCAD (2021)
Yibo Liu, Shuyuan Yu, Shaoyi Peng, Sheldon X.-D. Tan
Runtime Long-Term Reliability Management Using Stochastic Computing in Deep Neural Networks. ISQED (2021)
Wentian Jin, Sheriff Sadiqbatcha, Jinwei Zhang, Sheldon X.-D. Tan
Full-Chip Thermal Map Estimation for Commercial Multi-Core CPUs with Generative Adversarial Learning. ICCAD (2020)
Shuyuan Yu, Han Zhou, Shaoyi Peng, Hussam Amrouch, Jörg Henkel, Sheldon X.-D. Tan
Run-Time Accuracy Reconfigurable Stochastic Computing for Dynamic Reliability and Power Management. CoRR (2020)
Han Zhou, Wentian Jin, Sheldon X.-D. Tan
GridNet: Fast Data-Driven EM-Induced IR Drop Prediction and Localized Fixing for On-Chip Power Grid Networks. ICCAD (2020)
Shaoyi Peng, Sheldon X.-D. Tan
GLU3.0: Fast GPU-based Parallel Sparse LU Factorization for Circuit Simulation. IEEE Des. Test 37 (3) (2020)
Wentian Jin, Sheriff Sadiqbatcha, Jinwei Zhang, Sheldon X.-D. Tan
EM-GAN: Fast Stress Analysis for Multi-Segment Interconnect Using Generative Adversarial Networks. CoRR (2020)
Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan
Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39 (4) (2020)
Wentian Jin, Sheriff Sadiqbatcha, Zeyu Sun, Han Zhou, Sheldon X.-D. Tan
EM-GAN: Data-Driven Fast Stress Analysis for Multi-Segment Interconnects. ICCD (2020)
Shaoyi Peng, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan
Full-chip wire-oriented back-end-of-line TDDB hotspot detection and lifetime analysis. Integr. 70 (2020)
Jinwei Zhang, Sheriff Sadiqbatcha, Wentian Jin, Sheldon X.-D. Tan
Accurate Power Density Map Estimation for Commercial Multi-Core Microprocessors. DATE (2020)
Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao
Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires. IEEE Trans. Very Large Scale Integr. Syst. 28 (2) (2020)
Han Zhou, Shuyuan Yu, Zeyu Sun, Sheldon X.-D. Tan
Reliable Power Grid Network Design Framework Considering EM Immortalities for Multi-Segment Wires. ASP-DAC (2020)
Sheldon X.-D. Tan, Zeyu Sun, Sheriff Sadiqbatcha
Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-Chip. IPSJ Trans. Syst. LSI Des. Methodol. 13 (2020)
Shuyuan Yu, Han Zhou, Shaoyi Peng, Hussam Amrouch, Jörg Henkel, Sheldon X.-D. Tan
Run-Time Accuracy Reconfigurable Stochastic Computing for Dynamic Reliability and Power Management: Work-in-Progress. CASES (2020)
Sheriff Sadiqbatcha, Yue Zhao, Jinwei Zhang, Hussam Amrouch, Jörg Henkel, Sheldon X.-D. Tan
Machine Learning Based Online Full-Chip Heatmap Estimation. ASP-DAC (2020)
Hai Wang, Xingxing Guo, Sheldon X.-D. Tan, Chi Zhang, He Tang, Yuan Yuan
Leakage-Aware Predictive Thermal Management for Multicore Systems Using Echo State Network. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39 (7) (2020)
Mohammadamir Kavousi, Liang Chen, Sheldon X.-D. Tan
Electromigration Immortality Check considering Joule Heating Effect for Multisegment Wires. ICCAD (2020)
Jinwei Zhang, Sheriff Sadiqbatcha, Yuanqi Gao, Michael O'Dea, Nanpeng Yu, Sheldon X.-D. Tan
HAT-DRL: Hotspot-Aware Task Mapping for Lifetime Improvement of Multicore System using Deep Reinforcement Learning. MLCAD (2020)
Shaoyi Peng, Wentian Jin, Liang Chen, Sheldon X.-D. Tan
Data-Driven Fast Electrostatics and TDDB Aging Analysis. MLCAD (2020)
Shaobin Ma, Xiaoyi Wang, Sheldon X.-D. Tan, Liang Chen, Jian He
An Adaptive Electromigration Assessment Algorithm for Full-chip Power/Ground Networks. ASP-DAC (2020)
Zeyu Sun, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan
Saturation-Volume Estimation for Multisegment Copper Interconnect Wires. IEEE Trans. Very Large Scale Integr. Syst. 27 (7) (2019)
Hai Wang, Diya Tang, Ming Zhang, Sheldon X.-D. Tan, Chi Zhang, He Tang, Yuan Yuan
GDP: A Greedy Based Dynamic Power Budgeting Method for Multi/Many-Core Systems in Dark Silicon. IEEE Trans. Computers 68 (4) (2019)
Sheriff Sadiqbatcha, Hengyang Zhao, Hussam Amrouch, Jörg Henkel, Sheldon X.-D. Tan
Hot Spot Identification and System Parameterized Thermal Modeling for Multi-Core Processors Through Infrared Thermal Imaging. DATE (2019)
Shaoyi Peng, Sheldon X.-D. Tan
GLU3.0: Fast GPU-based Parallel Sparse LU Factorization for Circuit Simulation. CoRR (2019)
Chase Cook, Wentian Jin, Sheldon X.-D. Tan
GPU-based Ising Computing for Solving Balanced Min-Cut Graph Partitioning Problem. CoRR (2019)
Han Zhou, Zeyu Sun, Sheriff Sadiqbatcha, Naehyuck Chang, Sheldon X.-D. Tan
EM-Aware and Lifetime-Constrained Optimization for Multisegment Power Grid Networks. IEEE Trans. Very Large Scale Integr. Syst. 27 (4) (2019)
Zeyu Sun, Han Zhou, Sheldon X.-D. Tan
Dynamic Reliability Management for Multi-Core Processor Based on Deep Reinforcement Learning. SMACD (2019)
Chase Cook, Hengyang Zhao, Takashi Sato, Masayuki Hiromoto, Sheldon X.-D. Tan
GPU-based Ising computing for solving max-cut combinatorial optimization problems. Integr. 69 (2019)
Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan
Reliability based hardware Trojan design using physics-based electromigration models. Integr. 66 (2019)
Ke Yang, Shaoyi Peng, Sheldon X.-D. Tan, Hai-Bao Chen
Multi-Thread Assembling for Fast FEM Power Delivery DC Integrity Analysis. ASICON (2019)
Zeyu Sun, Taeyoung Kim, Marcus Chow, Shaoyi Peng, Han Zhou, Hyoseung Kim, Daniel Wong, Sheldon X.-D. Tan
Long-Term Reliability Management For Multitasking GPGPUs. SMACD (2019)
Hai Wang, Jiachun Wan, Sheldon X.-D. Tan, Chi Zhang, He Tang, Yuan Yuan, Keheng Huang, Zhenghong Zhang
A Fast Leakage-Aware Full-Chip Transient Thermal Estimation Method. IEEE Trans. Computers 67 (5) (2018)
Han Zhou, Yijing Sun, Zeyu Sun, Hengyang Zhao, Sheldon X.-D. Tan
Electromigration-lifetime constrained power grid optimization considering multi-segment interconnect wires. ASP-DAC (2018)
Zeyu Sun, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan
Accelerating electromigration aging for fast failure detection for nanometer ICs. ASP-DAC (2018)
Ana Dalia Pano-Azucena, Esteban Tlelo-Cuautle, Sheldon X.-D. Tan
Electronic System for Chaotic Time Series Prediction Associated to Human Disease. ICHI (2018)
Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Chase Cook, Sheldon X.-D. Tan
Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 37 (12) (2018)
Yuan Cheng, Guangya Li, Hai-Bao Chen, Sheldon X.-D. Tan, Hao Yu
DEEPEYE: A Compact and Accurate Video Comprehension at Terminal Devices Compressed with Quantization and Tensorization. CoRR (2018)
Shengcheng Wang, Taeyoung Kim, Zeyu Sun, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori
Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 26 (3) (2018)
Taeyoung Kim, Sheldon X.-D. Tan, Chase Cook, Zeyu Sun
Detection of counterfeited ICs via on-chip sensor and post-fabrication authentication policy. Integr. 63 (2018)
Shaoyi Peng, Han Zhou, Taeyoung Kim, Hai-Bao Chen, Sheldon X.-D. Tan
Physics-Based Compact TDDB Models for Low-k BEOL Copper Interconnects With Time-Varying Voltage Stressing. IEEE Trans. Very Large Scale Integr. Syst. 26 (2) (2018)
Taeyoung Kim, Zao Liu, Sheldon X.-D. Tan
Dynamic reliability management based on resource-based EM modeling for multi-core microprocessors. Microelectron. J. 74 (2018)
Ana Dalia Pano-Azucena, Esteban Tlelo-Cuautle, Sheldon X.-D. Tan
Prediction of chaotic time series by using ANNs, ANFIS and SVMs. MOCAST (2018)
Hengyang Zhao, Sheldon X.-D. Tan
Postvoiding FEM Analysis for Electromigration Failure Characterization. IEEE Trans. Very Large Scale Integr. Syst. 26 (11) (2018)
Sheriff Sadiqbatcha, Chase Cook, Zeyu Sun, Sheldon X.-D. Tan
Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires. SMACD (2018)
Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan
Reliability Based Hardware Trojan Design Using Physics-Based Electromigration Models. SMACD (2018)
Sheldon X.-D. Tan, Hussam Amrouch, Taeyoung Kim, Zeyu Sun, Chase Cook, Jörg Henkel
Recent advances in EM and BTI induced reliability modeling, analysis and optimization (invited). Integr. 60 (2018)
Hengyang Zhao, Qi Hua, Hai-Bao Chen, Yaoyao Ye, Hai Wang, Sheldon X.-D. Tan, Esteban Tlelo-Cuautle
Thermal-Sensor-Based Occupancy Detection for Smart Buildings Using Machine-Learning Methods. ACM Trans. Design Autom. Electr. Syst. 23 (4) (2018)
Hengyang Zhao, Sheldon X.-D. Tan
Multi-physics-based FEM analysis for post-voiding analysis of electromigration failure effects. ICCAD (2018)
Chase Cook, Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan
Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method. IEEE Trans. Very Large Scale Integr. Syst. 26 (5) (2018)
Xiaoyi Wang, Hongyu Wang, Jian He, Sheldon X.-D. Tan, Yici Cai, Shengqi Yang
Physics-based electromigration modeling and assessment for multi-segment interconnects in power grid networks. DATE (2017)
Taeyoung Kim, Zeyu Sun, Hai-Bao Chen, Hai Wang, Sheldon X.-D. Tan
Energy and Lifetime Optimizations for Dark Silicon Manycore Microprocessor Considering Both Hard and Soft Errors. IEEE Trans. Very Large Scale Integr. Syst. 25 (9) (2017)
Xin Huang, Valeriy Sukharev, Taeyoung Kim, Sheldon X.-D. Tan
Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing. Integr. 58 (2017)
Shengcheng Wang, Hengyang Zhao, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori
Recovery-aware proactive TSV repair for electromigration in 3D ICs. DATE (2017)
Jiangtao Peng, Hai-Bao Chen, Hengyang Zhao, Zeyu Sun, Sheldon X.-D. Tan
Dynamic temperature-aware reliability modeling for multi-branch interconnect trees. ASICON (2017)
Yaoyao Ye, Taeyoung Kim, Hai-Bao Chen, Hai Wang, Esteban Tlelo-Cuautle, Sheldon X.-D. Tan
Comprehensive detection of counterfeit ICs via on-chip sensor and post-fabrication authentication policy. SMACD (2017)
Xiaoyi Wang, Yan Yan, Jian He, Sheldon X.-D. Tan, Chase Cook, Shengqi Yang
Fast physics-based electromigration analysis for multi-branch interconnect trees. ICCAD (2017)
Ana Dalia Pano-Azucena, Esteban Tlelo-Cuautle, Luis Gerardo de la Fraga, Carlos Sánchez-López, Jose de Jesus Rangel-Magdaleno, Sheldon X.-D. Tan
Prediction of chaotic time-series with different MLE values using FPGA-based ANNs. SMACD (2017)
Wei He, Hengyang Zhao, Zhongdong Qi, Hai-Bao Chen, Sheldon X.-D. Tan
Fast two-dimensional finite element analysis for power network DC integrity checks of PCBs. ASICON (2017)
Krishnendu Chakrabarty, Massimo Alioto, Bevan M. Baas, Chirn Chye Boon, Meng-Fan Chang, Naehyuck Chang, Yao-Wen Chang, Chip-Hong Chang, Shih-Chieh Chang, Poki Chen, Masud H. Chowdhury, Pasquale Corsonello, Ibrahim Abe M. Elfadel, Said Hamdioui, Masanori Hashimoto, Tsung-Yi Ho, Houman Homayoun, Yuh-Shyan Hwang, Rajiv V. Joshi, Tanay Karnik, Mehran Mozaffari Kermani, Chulwoo Kim, Tae-Hyoung Kim, Jaydeep P. Kulkarni, Eren Kursun, Erik Larsson, Hai (Helen) Li, Huawei Li, Patrick P. Mercier, Prabhat Mishra, Makoto Nagata, Arun S. Natarajan, Koji Nii, Partha Pratim Pande, Ioannis Savidis, Mingoo Seok, Sheldon X.-D. Tan, Mark M. Tehranipoor, Aida Todri-Sanial, Miroslav N. Velev, Xiaoqing Wen, Jiang Xu, Wei Zhang, Zhengya Zhang, Stacey Weber Jackson
Editorial. IEEE Trans. Very Large Scale Integr. Syst. 25 (1) (2017)
Shengcheng Wang, Zeyu Sun, Yuan Cheng, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori
Leveraging recovery effect to reduce electromigration degradation in power/ground TSV. ICCAD (2017)
Hengyang Zhao, Zhongdong Qi, Shujuan Wang, Kambiz Vafai, Hai Wang, Hai-Bao Chen, Sheldon X.-D. Tan
Learning-based occupancy behavior detection for smart buildings. ISCAS (2016)
Xin Huang, Valeriy Sukharev, Jun-Ho Choy, Marko Chew, Taeyoung Kim, Sheldon X.-D. Tan
Electromigration assessment for power grid networks considering temperature and thermal stress effects. Integr. 55 (2016)

Sheldon X.-D. Tan.css-eqlu8i{font-size:small;padding-left:4px;}

Publication Activity (10 Years)

Top Topics

Top Venues

Sheldon X.-D. Tan