Full-Chip Power Density and Thermal Map Characterization for Commercial Microprocessors Under Heat Sink Cooling.
Jinwei ZhangSheriff SadiqbatchaMichael O'DeaHussam AmrouchSheldon X.-D. TanPublished in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2022)
Keyphrases
- electrical power
- heat transfer
- power system
- electrical energy
- single chip
- transmission line
- power supply
- ibm power processor
- numerical simulations
- thermal conductivity
- instruction set
- high speed
- distribution systems
- low cost
- power consumption
- power generation
- finite element method
- multithreading
- computing power
- personal computer
- low power
- chip design
- physical design
- mathematical models
- power dissipation
- power distribution
- level parallelism
- maximum a posteriori
- data transmission
- wind turbine
- energy consumption
- power plant