Eren Kursun

Publication Activity (10 Years)

Years Active: 2002-2021
Publications (10 Years): 8

Top Topics

Integrated Circuit

Spatial And Temporal

Security Threats

Solder Ball Connect

Top Venues

ACM Great Lakes Symposium on VLSI

IEEE Trans. Very Large Scale Integr. Syst.

ACM J. Emerg. Technol. Comput. Syst.

Publications

Hongda Shen, Eren Kursun
Label Augmentation via Time-based Knowledge Distillation for Financial Anomaly Detection. CoRR (2021)
Teng Yang, Pavan Kumar Chundi, Seongjong Kim, Eren Kursun, Martha A. Kim, Peter R. Kinget, Mingoo Seok
Compact and voltage-scalable sensor for accurate thermal sensing in dynamic thermal management. MWSCAS (2017)
Pavan Kumar Chundi, Yini Zhou, Martha A. Kim, Eren Kursun, Mingoo Seok
Hotspot monitoring and Temperature Estimation with miniature on-chip temperature sensors. ISLPED (2017)
Jaya Dofe, Peng Gu, Dylan C. Stow, Qiaoyan Yu, Eren Kursun, Yuan Xie
Security Threats and Countermeasures in Three-Dimensional Integrated Circuits. ACM Great Lakes Symposium on VLSI (2017)
Krishnendu Chakrabarty, Massimo Alioto, Bevan M. Baas, Chirn Chye Boon, Meng-Fan Chang, Naehyuck Chang, Yao-Wen Chang, Chip-Hong Chang, Shih-Chieh Chang, Poki Chen, Masud H. Chowdhury, Pasquale Corsonello, Ibrahim Abe M. Elfadel, Said Hamdioui, Masanori Hashimoto, Tsung-Yi Ho, Houman Homayoun, Yuh-Shyan Hwang, Rajiv V. Joshi, Tanay Karnik, Mehran Mozaffari Kermani, Chulwoo Kim, Tae-Hyoung Kim, Jaydeep P. Kulkarni, Eren Kursun, Erik Larsson, Hai (Helen) Li, Huawei Li, Patrick P. Mercier, Prabhat Mishra, Makoto Nagata, Arun S. Natarajan, Koji Nii, Partha Pratim Pande, Ioannis Savidis, Mingoo Seok, Sheldon X.-D. Tan, Mark M. Tehranipoor, Aida Todri-Sanial, Miroslav N. Velev, Xiaoqing Wen, Jiang Xu, Wei Zhang, Zhengya Zhang, Stacey Weber Jackson
Editorial. IEEE Trans. Very Large Scale Integr. Syst. 25 (1) (2017)
Qiaosha Zou, Eren Kursun, Yuan Xie
Thermomechanical Stress-Aware Management for 3-D IC Designs. IEEE Trans. Very Large Scale Integr. Syst. 25 (9) (2017)
Peng Gu, Shuangchen Li, Dylan C. Stow, Russell Barnes, Liu Liu, Yuan Xie, Eren Kursun
Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges. ACM Great Lakes Symposium on VLSI (2016)
Peng Gu, Dylan C. Stow, Russell Barnes, Eren Kursun, Yuan Xie
Thermal-aware 3D design for side-channel information leakage. ICCD (2016)
Philip G. Emma, Alper Buyuktosunoglu, Michael B. Healy, Krishnan Kailas, Valentin Puente, Roy Yu, Allan Hartstein, Pradip Bose, Jaime H. Moreno, Eren Kursun
3D stacking of high-performance processors. HPCA (2014)
Yibo Chen, Eren Kursun, Dave Motschman, Charles Johnson, Yuan Xie
Through Silicon Via Aware Design Planning for Thermally Efficient 3-D Integrated Circuits. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32 (9) (2013)
Qiaosha Zou, Tao Zhang, Eren Kursun, Yuan Xie
Thermomechanical stress-aware management for 3D IC designs. DATE (2013)
Guangyu Sun, Eren Kursun, Jude A. Rivers, Yuan Xie
Exploring the vulnerability of CMPs to soft errors with 3D stacked nonvolatile memory. ACM J. Emerg. Technol. Comput. Syst. 9 (3) (2013)
Huapeng Zhou, Xin Li, Chen-Yong Cher, Eren Kursun, Haifeng Qian, Shi-Chune Yao
An information-theoretic framework for optimal temperature sensor allocation and full-chip thermal monitoring. DAC (2012)
Eren Kursun, Jamil A. Wakil, Mukta Farooq, Robert Hannon
Spatial and temporal thermal characterization of stacked multicore architectures. ACM J. Emerg. Technol. Comput. Syst. 8 (3) (2012)
Haifeng Qian, Sachin S. Sapatnekar, Eren Kursun
Fast poisson solvers for thermal analysis. ACM Trans. Design Autom. Electr. Syst. 17 (3) (2012)
Guangyu Sun, Eren Kursun, Jude A. Rivers, Yuan Xie
Exploring the vulnerability of CMPs to soft errors with 3D stacked non-volatile memory. ICCD (2011)
Víctor Jiménez, Francisco J. Cazorla, Roberto Gioiosa, Eren Kursun, Canturk Isci, Alper Buyuktosunoglu, Pradip Bose, Mateo Valero
Energy-Aware Accounting and Billing in Large-Scale Computing Facilities. IEEE Micro 31 (3) (2011)
Chen-Yong Cher, Eren Kursun
Exploring the effects of on-chip thermal variation on high-performance multicore architectures. ACM Trans. Archit. Code Optim. 8 (1) (2011)
Yibo Chen, Eren Kursun, Dave Motschman, Charles Johnson, Yuan Xie
Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs. ISLPED (2011)
Jeff Burns, Gary Carpenter, Eren Kursun, Ruchir Puri, James D. Warnock, Michael Scheuermann
Design, CAD and technology challenges for future processors: 3D perspectives. DAC (2011)
Víctor Jiménez, Francisco J. Cazorla, Roberto Gioiosa, Mateo Valero, Carlos Boneti, Eren Kursun, Chen-Yong Cher, Canturk Isci, Alper Buyuktosunoglu, Pradip Bose
Characterizing Power and Temperature Behavior of POWER6-Based System. IEEE J. Emerg. Sel. Topics Circuits Syst. 1 (3) (2011)
Pradip Bose, Alper Buyuktosunoglu, Chen-Yong Cher, John A. Darringer, Meeta Sharma Gupta, Hendrik F. Hamann, Hans M. Jacobson, Prabhakar Kudva, Eren Kursun, Niti Madan, Indira Nair, Jude A. Rivers, Jeonghee Shin, Alan J. Weger, Victor V. Zyuban
Power-efficient, reliable microprocessor architectures: modeling and design methods. ACM Great Lakes Symposium on VLSI (2010)
Víctor Jiménez, Francisco J. Cazorla, Roberto Gioiosa, Mateo Valero, Carlos Boneti, Eren Kursun, Chen-Yong Cher, Canturk Isci, Alper Buyuktosunoglu, Pradip Bose
Power and thermal characterization of POWER6 system. PACT (2010)
Víctor Jiménez, Roberto Gioiosa, Eren Kursun, Francisco J. Cazorla, Chen-Yong Cher, Alper Buyuktosunoglu, Pradip Bose, Mateo Valero
Trends and techniques for energy efficient architectures. VLSI-SoC (2010)
Philip G. Emma, Eren Kursun
Opportunities and Challenges for 3D Systems and Their Design. IEEE Des. Test Comput. 26 (5) (2009)
Eren Kursun, Chen-Yong Cher
Temperature Variation Characterization and Thermal Management of Multicore Architectures. IEEE Micro 29 (1) (2009)
Yuchun Ma, Yongxiang Liu, Eren Kursun, Glenn Reinman, Jason Cong
Investigating the effects of fine-grain three-dimensional integration on microarchitecture design. ACM J. Emerg. Technol. Comput. Syst. 4 (4) (2008)
Philip G. Emma, Eren Kursun
Is 3D chip technology the next growth engine for performance improvement? IBM J. Res. Dev. 52 (6) (2008)
Eren Kursun, Chen-Yong Cher
Variation-aware thermal characterization and management of multi-core architectures. ICCD (2008)
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinman, Jason Cong
Fine grain 3D integration for microarchitecture design through cube packing exploration. ICCD (2007)
Eren Kursun, Anahita Shayesteh, Suleyman Sair, Timothy Sherwood, Glenn Reinman
An Evaluation of Deeply Decoupled Cores. J. Instr. Level Parallelism 8 (2006)
Eren Kursun, Rajarshi Mukherjee, Seda Ogrenci Memik
Early Quality Assessment for Low Power Behavioral Synthesis. J. Low Power Electron. 1 (3) (2005)
Anahita Shayesteh, Eren Kursun, Timothy Sherwood, Suleyman Sair, Glenn Reinman
Reducing the Latency and Area Cost of Core Swapping through Shared Helper Engines. ICCD (2005)
Eren Kursun, Glenn Reinman, Suleyman Sair, Anahita Shayesteh, Timothy Sherwood
Low-Overhead Core Swapping for Thermal Management. PACS (2004)
Eren Kursun, Soheil Ghiasi, Majid Sarrafzadeh
Transistor Level Budgeting for Power Optimization. ISQED (2004)
Seda Ogrenci Memik, Gokhan Memik, Roozbeh Jafari, Eren Kursun
Global resource sharing for synthesis of control data flow graphs on FPGAs. DAC (2003)
Ankur Srivastava, Eren Kursun, Majid Sarrafzadeh
Predictability in RT-Level Designs. J. Circuits Syst. Comput. 11 (4) (2002)
Eren Kursun, Ankur Srivastava, Seda Ogrenci Memik, Majid Sarrafzadeh
Early evaluation techniques for low power binding. ISLPED (2002)